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ACLS | US
-3.67
-4.27%
Technology
Semiconductor Equipment & Materials
30/06/2024
06/03/2026
82.24
82.84
84.79
80.22
Axcelis Technologies Inc. designs manufactures and services ion implantation and other processing equipment used in the fabrication of semiconductor chips in the United States Europe and Asia Pacific. The company offers high energy high current and medium current implanters for various application requirements. It also provides aftermarket lifecycle products and services including used tools spare parts equipment upgrades maintenance services and customer training. It sells its equipment and services to semiconductor chip manufacturers through its direct sales force. Axcelis Technologies Inc. was founded in 1978 and is headquartered in Beverly Massachusetts.
View LessLow Debt to Equity (< 0.25)
Low Debt to Asset (< 0.2)
Negative Momentum (Declining Price)
Price Below SMA10D
Midcap (2B - 10B USD)
High Market Beta (> 0.8)
Declining Revenue (< 0%)
Bullish: Stable Volatility (6-month <= 1-month volatility) is positive for the stock performance.
10 days
46.6%1 month
75.4%3 months
59.4%6 months
52.3%12.71
12.80
3.22
0.08
0.06
8.43
2.25
1.23
268.93M
2.68B
2.68B
-
20.59
-16.70
-6.40
28.52
3.04
9.46
Short-term: Bearish (SMA10D < SMA1M)
Intermediate-term: Bearish (SMA1M < SMA3M)
Long-term: Bullish (SMA6M > SMA12M)
Range10D
11.69
Range1M
23.80
Range3M
25.31
Rel. volume
0.58
Price X volume
52.75M
Name | Ticker | Industry | Close | Marketcap | Day Return | PE Ratio | Debt to Equity |
|---|---|---|---|---|---|---|---|
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|---|---|---|---|---|---|---|---|
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| Parameter | Company | Industry | Indicator |
|---|---|---|---|
| Enterprise to EBITDA | 8.43 | - | Cheaper |
| Ent. to Revenue | 2.25 | - | Cheaper |
| PE Ratio | 12.71 | 37.93 | Cheaper |
| Price to Book | 3.22 | 5.46 | Cheaper |
| Dividend Yield | - | - | - |
| Std. Deviation (3M) | 59.38 | - | Par |
| Debt to Equity | 0.08 | 0.33 | Cheaper |
| Debt to Assets | 0.06 | 0.14 | Cheaper |
| Market Cap | 2.68B | - | Emerging |