Amkor Technology Inc

Amkor Technology Inc. provides outsourced semiconductor packaging and test services in the United States Japan Europe the Middle East Africa and Asia Pacific. It offers turnkey packaging and test services including semiconductor wafer bump wafer probe wafer back-grind package design packaging system-level and final test and drop shipment services. The company provides flip chip-scale package products for smartphones tablets and other mobile consumer electronic devices; flip-chip stacked chip-scale packages that are used to stack memory digital baseband and as applications processors in mobile devices; and flip-chip ball grid array packages for various networking storage computing and consumer applications. In addition it offers wafer-level CSP packages that are used in power management transceivers sensors wireless charging codecs radar and specialty silicon; wafer-level fan-out packages includes power management transceivers radar and specialty silicon for use in ICs; and silicon wafer integrated fan-out technology which replaces a laminate substrate with a thinner structure. Further the company provides lead frame packages that are used in electronic devices for low to medium pin count analog and mixed-signal applications; and substrate-based wirebond packages used to connect a die to a substrate. Additionally it offers micro-electro-mechanical systems (MEMS) packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules which are used in radio frequency and front end modules basebands connectivity fingerprint sensors display and touch screen drivers sensors and MEMS and NAND memory and solid-state drives. The company primarily serves integrated device manufacturers fabless semiconductor companies original equipment manufacturers and contract foundries. Amkor Technology Inc. was founded in 1968 and is headquartered in Tempe Arizona.